IEC 60115-1:20 20是通用规范，适用于电子设备中使用的固定电阻器。它建立了标准术语、检验程序和测试方法，用于电子元件的分段和详细规范，用于质量评估或任何其他目的。 与上一版相比，此版本包含以下重大技术变更: 第5版采用了新的文件结构，其中先前第4条的测试现在在第6至12条中给出，信息性附件X提供了与本标准先前修订版的交叉引用； 对术语和定义进行了修订和修正，并补充了关于电阻器技术的新章节和关于产品分类级别的新章节；增加了关于允许替代品建议的新的第4.7款； 第4.8、4.9和4.10款中关于包装、储存和运输的规定已完全修订； 增加了关于最常见测试参数默认公差的新子条款5.3； 作为对先前4.5的修订，测量电阻的通用方法（现为子条款5.6）已从6.1中规定电阻值的符合性测试中分离出来； 子条款6.2中电阻温度系数的测试是先前测试4.8电阻随温度的变化的修订，其中10 Ω以下电阻的特殊优惠已被放弃； 第7.1至7.3款（原第4.25.1至4.25.3款）耐久性试验的试验方法已完全修订；单曲？脉搏高？子条款8.2（之前的4.27）的电压过载测试已经完全修订，现在为1、2/50和10/700脉冲形状提供了可调的严重性，以提高显著性的详细规范的益处； 修订了子条款8.3（先前4.28）中的周期性脉冲高压过载试验，并提供了修正的严重程度表； 子条款8.4（之前的4.39）的周期脉冲过载测试已被弃用，并被简化为仅提供从属规范中历史应用的严重性； 关于目视检查的子条款9.1、关于尺寸测量的子条款9.2和关于详细尺寸评估的子条款9.3（先前4.4的所有部分）已完全修订； 已修订端子稳健性试验（先前4.16），并将其分为可焊端子稳健性试验（子条款9）。5，以及螺纹螺柱或螺钉终端的坚固性测试，子条款9.6； 修订了子条款9.9（先前4.20）的碰撞试验和子条款9.10（先前4.21）的冲击试验，以反映合并的相关试验标准IEC 60068-2-29； 修改了第10.3款（原4.23）气候序列的干热和冷试验，以反映相关试验标准IEC 60068的变化？2？2和IEC 60068？2？1; 修改了第10.5款（前4.37）的加速湿热稳态试验，增加了减少偏置电压数量的选项； 为了采用IEC 60068-2-52的更合适的试验方法，而不是先前使用的IEC 60068-2-11，对第10.6款的腐蚀试验进行了彻底修订； 第10款的晶须生长试验。7进行了修订，以反映IEC 60068-2-82试验方法新修订版的变化； 子条款11.1（先前4.17）的可焊性和子条款11.2（先前4.18）的耐焊接热试验方法已经完全修订，以纳入各种含铅和无铅焊料合金的必要选项以及各自的工艺条件； 子条款11.3的耐溶剂性试验将先前的试验4.29（组分耐溶剂性）和4.30（标记的耐溶剂性）合并为一项试验； 子条款12.3（原4.26）的意外过载试验已完全修订； 关于质量评估程序的附件Q已经完全修订； 增加了关于故障率评估、测定和鉴定的新附录R。

IEC 60115-1:2020 is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This edition contains the following significant technical changes with respect to the previous edition:

1. this 5th edition employs a new document structure, where the tests of prior Clause 4 are given in Clauses 6 to 12 now, with an informative Annex X providing cross-references for references to the prior revision of this standard;
2. the terms and definitions have been revised and amended, supplemented by a new section on resistor technologies and a new section on product classification levels;
3. a new Subclause 4.7 on recommendations for permissible substitutions has been added;
4. the provisions for packaging, storage and transportation in Subclauses 4.8, 4.9 and 4.10 have been completely revised;
5. a new Subclause 5.3 on default tolerances for the most common test parameters has been added;
6. the generic method of measuring resistance, now Sublause 5.6, has been separated from the test for compliance with a prescribed resistance value in 6.1, as a revision of the prior 4.5;
7. the test for the temperature coefficient of resistance of Subclause 6.2 is a revision of the prior test 4.8, variation of resistance with temperature, where the special concessions for resistors below 10 Ω have been waived;
8. the test methods for endurance testing of Subclauses 7.1 to 7.3 (prior 4.25.1 to 4.25.3) have been completely revised;
9. the single？pulse high？voltage overload test of Subclause 8.2 (prior 4.27) has been completely revised, and now offers adjustable severities for the 1,2/50 and for the 10/700 pulse shape for the benefit of detail specifications with improved significance;
10. the periodic-pulse high-voltage overload test of Subclause 8.3 (prior 4.28) has been revised and a corrected table of severities provided;
11. the period-pulse overload test of Subclause 8.4 (prior 4.39) has been deprecated and streamlined to only offer the severity historically applied in subordinate specifications;
12. the Subclauses 9.1 on visual inspection, 9.2 on the gauging of dimensions, and 9.3 on the assessment of detail dimensions (all parts of prior 4.4) have been completely revised;
13. the tests for robustness of terminations (prior 4.16) have been revised and separated into tests for the robustness of solderable terminations, Subclause 9.5, and tests for the robustness of threaded stud or screw terminations, Subclause 9.6;
14. the bump test of Subclause 9.9 (prior 4.20) and the shock test of Subclause 9.10 (prior 4.21) have been revised to reflect the merged relevant test standard IEC 60068-2-29;
15. the dry heat and cold test of the climatic sequence of Subclause 10.3 (prior 4.23) have been revised to reflect the changes of the relevant test standards IEC 60068？2？2 and IEC 60068？2？1;
16. the accelerated damp heat, steady state test of Subclause 10.5 (prior 4.37) has been amended with an option for a reduced number of bias voltages;
17. the corrosion test of Subclause 10.6 has been completely revised in order to employ the better suitable test method of IEC 60068-2-52 instead of the prior used IEC 60068-2-11;
18. the whisker growth test of Subclause 10.7 has been revised to reflect the changes of the new revision of the test methods of IEC 60068-2-82;
19. the test methods for solderability of Subclause 11.1 (prior 4.17) and for resistance to soldering heat of Subclause 11.2 (prior 4.18) have been completely revised to incorporate the necessary option for the variety of lead-bearing and lead-free solder alloys and respective process conditions;
20. the solvent resistance test of Subclause 11.3 combines the prior tests 4.29, component solvent resistance, and 4.30, solvent resistance of marking, in one test;
21. the accidental overload test of Subclause 12.3 (prior 4.26) has been completely revised;
22. the Annex Q on quality assessment procedures has been completely revised;
23. a new Annex R on failure rate evaluation, determination and qualification has been added.