本文件已被宣布为“稳定”，不再接受货币定期审查。用户负责验证参考资料和持续适用性或技术要求。新技术可能存在。本文件规定了航空和航天应用中电气、航空电子、武器、通信和电子设备装置的电气连接和接地的最低要求。本文规定的连接和接地要求旨在确保为电气、航空电子、武器、通信和电子设备提供足够的低电阻回路，能够承受工作条件和腐蚀。这对于减少进出设备的电磁场耦合、提供电气稳定性以控制静电荷和放电产生的电流和/或电压以及抑制其危险影响至关重要。 有效控制电磁干扰（EMI）和电气效应危害的先决条件是建立参考地平面，以及提供足够连接的方法。连接到地平面就是接地，而在导体之间提供低阻抗接头的机械方法就是电连接。

This document has been declared "Stabilized" and will no longer be subjected to periodic reviews for currency. Users are responsible for verifying references and continued suitability or technical requirements. New technology may exist.This document establishes the minimum requirements for the electrical bonding and grounding of electric, avionic, armament, communication, and electronic equipment installations for aeronautical and aerospace applications. The bonding and grounding requirements specified herein are to ensure that an adequate low resistance return path for electric, avionic, armament, communication and electronic equipment is achieved which can withstand operating conditions and corrosion. This is essential for the reduction of coupling of electromagnetic fields into or out of the equipment as well as for providing electrical stability to control the currents and/or voltages caused by static charges and discharges and for suppressing the hazardous effects thereof. A prerequisite to effective control of electromagnetic interference (EMI) and the hazards of electrical effects is the establishing of a reference ground plane and the means of providing adequate connections to it. Making a connection to the ground plane is grounding, and the mechanical method of providing a low impedance union between conductors is electrical bonding.