本文件描述了印制电路板（PWB）组件应变计测试的具体指南。建议的程序使电路板制造商能够独立进行所需的应变计测试，并为测量电路板弯曲度和评估风险水平提供了定量方法。涵盖的主题包括:测试设置和设备；要求；应变测量；报告格式。

This document describes specific guidelines for strain gage testing for Printed Wiring Board (PWB)assemblies. The suggested procedures enables board manufacturers to conduct required strain gage testing independently, and provides a quantitative method for measuring board flexure, and assessing risk levels. The topics covered include: Test setup and equipment; requirements; Strain measurement; Report format.