IEC？62239-1:20 18定义了制定电子元件管理计划（ECMP）的要求，以向客户保证计划所有者设备中的所有电子元件都被选择并应用于与最终应用兼容的受控过程中，并且满足第4条中详述的技术要求。一般来说，完整电子元件管理计划（ECMP）的计划所有者是航空电子原始设备制造商（OEM）。 这个第一版取消和取代？2015年发布的IEC TS 62239-1。与上一版相比，此版本包括以下重大技术变更: A）？增加了SAE EIA-STD-4899、IECQ OD 3702、IECQ OD 3407-1、IEC TR 62240-2、IECQ组件方案、SAE AS6081、SAE AS6171的参考。GEIA-STD-0005-1 GEIA STD 0008； b）？将附录C（已转移至IEC TR 62240-2）替换为SAE EIASTD4899修订版C条款/子条款的交叉引用表，仅用于指导目的； c）？增加了组件技术勘误分析 d）？更新的参考书目和参考文件

IEC？62239-1:2018 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the plan owner of a complete electronic components management plan (ECMP) is the avionics original equipment manufacturer (OEM).
This first edition cancels and replaces？IEC TS 62239-1 published in 2015. This edition includes the following significant technical changes with respect to the previous edition:
a)？added references to SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR 62240-2, IECQ component schemes, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA STD 0008;
b)？replaced Annex C (which was transferred into IEC TR 62240-2) with a cross-reference table to SAE EIASTD4899 rev C clauses/ subclauses for guidance purposes only;
c)？added the analysis of component technical erratum
d)？updated Bibliography and reference documents