现行

MIL MIL-I-24768/26

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, EPOXY-RESIN (PEE)
绝缘、塑料、层压、热固性、纸基、环氧树脂（PEE）

1992-02-25

现行

MIL MIL-I-24768/26 Notice 1-Validation 1

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, EPOXY-RESIN (PEE)
绝缘材料 塑料 层压 热固性 纸基 环氧树脂（PEE）

2020-03-10

现行

NZS 7607

Plastics - Decorative laminated sheets based on thermosetting resins
塑料.基于热固性树脂的装饰性层压板

现行

GB/T 1303.4-2009

电气用热固性树脂工业硬质层压板 第4部分：环氧树脂硬质层压板
Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 4: Requirements for rigid laminated sheets based on epoxy resins

2009-06-10

现行

MIL MIL-I-24768/11

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBG）

1992-02-25

现行

MIL MIL-I-24768/12

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBM）

1992-02-25

现行

MIL MIL-I-24768/10

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBE）

1992-02-25

现行

MIL MIL-I-24768/11 Notice 1-Validation 1

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG)
酚醛树脂（PBG）纸基层压热固性塑料绝缘材料

2020-03-09

现行

MIL MIL-I-24768/12 Notice 1-Validation 1

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM)
酚醛树脂（PBM）纸基层压热固性塑料绝缘材料

2020-03-09

现行

MIL MIL-I-24768/20

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-PC)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBM-PC）

1992-02-25

现行

MIL MIL-I-24768/21

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
纸基酚醛树脂（PBG-P）热固性层压塑料绝缘层

1992-02-25

现行

MIL MIL-I-24768/23

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE-PC)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBE-PC）

1992-02-25

现行

MIL MIL-I-24768/24

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-PF)
纸基酚醛树脂（PBM-PF）热固性层压塑料绝缘层

1992-02-25

现行

MIL MIL-I-24768/19

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-P)
纸基酚醛树脂（PBM-P）热固性层压塑料绝缘材料

1992-02-25

现行

MIL MIL-I-24768/25

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE-PCF)
纸基酚醛树脂（PBE-PCF）热固性层压塑料绝缘层

1992-02-25

现行

MIL MIL-I-24768/22

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
纸基酚醛树脂（PBG-P）热固性层压塑料绝缘层

1992-02-25

现行

MIL MIL-I-24768/25 Notice 1-Validation 1

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE-PCF)
酚醛树脂（PBE-PCF）纸基层压热固性塑料绝缘材料

2020-03-10

现行

MIL MIL-I-24768/22 Notice 1-Validation 1

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
酚醛树脂（PBG-P）纸基热固性层压塑料绝缘材料

2020-03-10

现行

MIL MIL-I-24768/19 Notice 1-Validation 1

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-P)
酚醛树脂（PBM-P）纸基层压热固性塑料绝缘材料

2020-03-11

现行

MIL MIL-I-24768/21 Notice 1-Validation 1

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
酚醛树脂（PBG-P）纸基热固性层压塑料绝缘材料

2020-03-10