JIS Z 3285:2017规定了使用JIS Z 3284-1中规定的粒度为symbol 7和symbol 8的细焊料颗粒（以下简称锡膏）的锡膏特性试验方法，主要用于将布线和组件连接到电子和通信设备中使用的高密度印刷电路板上，布线精细（例如，最小导体宽度和最小导体间距为60µm或更小）。本标准中规定的试验方法考虑了细焊料颗粒高表面活性的影响，因此，与使用JIS Z 3284系列中规定的试验方法进行试验相比，此类焊料颗粒的试验精度更高。

JIS Z 3285:2017 specifies the characteristics test methods for solder paste using fine solder particles with a particle size of symbol 7 and symbol 8 specified in JIS Z 3284-1 (hereafter referred to as solder paste), mainly intended for connection of wiring and components to high-density printed circuit boards with fine wiring (e.g. 60 µm or smaller in minimum conductor width and minimum conductor spacing) used in electronic and communication devices. The test methods specified in this Standard incorporate consideration for the effect of high surface activity of fine solder particles, so that such solder particles can be tested with better precision than when tested using the test methods specified in JIS Z 3284 series.