IPC HDI委员会认识到日本在微孔基板生产方面的领先地位，选择采用JPCA-BU01作为IPC/JPCA-6801。本文件的通过是IPC HDI委员会和JPCA Build-Up PWB委员会持续努力的一部分，以确保HDI和microvia应用的术语、要求和测试方法的全球一致性。IPC/JPCA-6801列出了材料和HDI PWB的HDI专用术语和CTE测试方法、剥离强度和热冲击。还包括设计标准表和开发HDI PWB标准的背景信息。

Recognizing Japan's leadership in microvia substrate production, the IPC HDI Committee chose to adopt JPCA-BU01 as IPC/JPCA-6801. The adoption of this document is a part of the ongoing efforts of the IPC HDI Committee and JPCA Build-Up PWB Committee to ensure global consistency in the terminology, requirements and test methods for HDI and microvia applications. IPC/JPCA-6801 lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also included is a design criteria table and background information for the development of a standard for HDI PWBs.