IEC 62899的本部分定义了可拉伸基板特性的测量方法，以便使用印刷技术形成的可拉伸功能层（导电、半导体和绝缘）进行评估。如果覆盖层薄膜使用与基材相同类型的材料，也应进行本文件中规定的测量。购买本文件时可获得的所有当前修订均包含在购买本文件中。

This part of IEC 62899 defines measurement methods for the properties of stretchable substrates, in order to use evaluating stretchable functional layers (conductive, semiconducting, and insulating) formed by printing technologies. If the same types of materials as the substrates are used for the cover lay film, they are also subjected to the measurement defined in this document.All current amendments available at time of purchase are included with the purchase of this document.