BS EN 62374-1. Semiconductor devices. Part 1. Time dependent dielectric breakdown test (TDDB)for inter-metal layers
英国标准EN 62374-1 半导体器件 第一部分 金属间层的时变介质击穿试验(TDDB)
发布日期:
2007-11-19
交叉引用:IEC-60747购买本文件时可获得的所有现行修订均包含在购买本文件中。
Cross References:IEC-60747All current amendments available at time of purchase are included with the purchase of this document.