Standard Guide for Transport Packaging Design
运输包装设计标准指南

2024-10-01

Guide Specifications for Design of Metal Flagpoles
金属旗杆设计指南规范

2007-10-05

Guide Specifications for Design of Metal Flagpoles
金属旗杆设计指南规范

2007-10-05

Design Guide for the Packaging of High Speed Electronic Circuits
高速电子电路封装设计指南

2003-11-01

医疗器械软性初包装设计与评价指南
Guide for design and evaluation of primary flexible packaging for medical devices

2020-09-27

Standard Guide for Design and Evaluation of Primary Flexible Packaging for Medical Products
医疗产品初级柔性包装的设计和评价标准指南

2023-10-01

Guide to the design, testing and use of packaging for the safe transport of radioactive materials
放射性材料安全运输包装设计、测试和使用指南

1976-01-30

金属管状液压成形零件设计要求
Guide line for design of metal tubular hydroforming part

2016-12-13

Standard Guide for Design and Construction of Expanded Metal Security Fences and Barriers
扩建金属安全栅栏和障碍物设计与施工标准指南

2020-04-01

Standard Guide for Additive Manufacturing — Design — Post-Processing for Metal PBF-LB
添加剂制造的标准指南.设计.金属PBF-LB的后处理

2022-04-01

Sintered metal materials; sint-guide-lines; part 2: designing of sintered parts
烧结金属材料；烧结指导线；第2部分:烧结件的设计

1990-10-01

BS EN 60191-6-17. Mechanical standardization of semiconductor devices. Part 6-17. Design guide for stacked packages and individual stackable packages. Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)
英国标准EN 60191-6-17 半导体器件的机械标准化 第6-17部分 堆叠包装和单个可堆叠包装的设计指南 细间距球网格阵列和细间距地网格阵列组件（FBGA/FLGA）

2007-06-19

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2003-03-04

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
半导体器件的机械标准化

2010-10-31

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2002-03-29

Draft Document - Mechanical standardization of semiconductor devices - Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) (IEC 47D/690/CD:2007)
文件草案.半导体器件的机械标准化.第6-17部分:堆叠封装和单个可堆叠封装的设计指南.细间距球栅阵列和细间距地栅阵列封装（FBGA/FLGA）（IEC 47D/690/CD:2007）

2007-10-01

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine-pitchball grid array (FBGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2001-11-15

Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
半导体器件的机械标准化第6-2部分:表面安装半导体器件封装外形图绘制的一般规则1.50mm、1.27mm和1.00mm节距球型和柱型端子封装的设计指南

2003-10-10

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
半导体器件的机械标准化.第6-2部分:表面安装半导体器件封装外形图绘制的一般规则.1,50mm、1,27mm和1,00mm节距球和柱端子封装的设计指南

2001-12-11

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2001-11-16