本文件定义了将光波耦合到集成光学芯片（IOC）和光子集成电路芯片（PIC）的相关特性。本文件主要关注通过波导端面的对接耦合。这些定义为指定与耦合特性相关的待耦合元件（如光纤、集成光学芯片）提供了依据。购买本文件时可获得的所有当前修订均包含在购买本文件中。

This document defines the relevant properties for coupling lightwaves into and out of integrated optical chips (IOC) and chips with photonic integrated circuits (PIC). This document mainly focuses on butt coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be coupled (e. g. fibres, integrated optical chips) related to coupling properties.All current amendments available at time of purchase are included with the purchase of this document.