1.1 本规范涵盖了工程用铜电镀层的要求。示例包括表面硬化、热处理停止、作为其他工程涂层的底板、用于电子电路中的电磁干扰（EMI）屏蔽以及某些连接操作。 1.2 本规范不适用于用作装饰饰面或用作其他装饰饰面的底涂层的电沉积铜。 1.3 本规范不适用于用于电铸的电沉积铜。 1.4 本国际标准是根据世界贸易组织技术性贸易壁垒委员会发布的《关于制定国际标准、指南和建议的原则的决定》中确立的国际公认的标准化原则制定的。

1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations. 1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes. 1.3 This specification is not intended for electrodeposited copper when used for electroforming. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.