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고정 배출원-반도체 및 디스플레이 공정에서의 온실가스 배출량 산정방법 固定源排放——半导体和显示工艺中温室气体(GHG)排放的测定
发布日期: 2023-12-29
该标准用于清洗半导体和显示器生产用含硅物质的等离子蚀刻(蚀刻)和硅沉淀的化学沉积(CVD)器具内壁的CF4、C2F6、C3F8、c-C4F8、c-C4F8O、C4F6、C5F8、CHF3、CH2F2、NF3、适用于SF6等氟化合物和N2O等非CO2温室气体的温室气体排放量计算。
이 표준은 반도체 및 디스플레이 생산을 위하여 실리콘 포함 물질의 플라즈마 식각(etching)과 실리콘이 침전되어 있던 화학증착(CVD) 기구의 내벽을 세정하는데 사용되는 CF4, C2F6, C3F8, c-C4F8, c-C4F8O, C4F6, C5F8, CHF3, CH2F2, NF3, SF6 등의 불소화합물과 N2O 등의 Non-CO2 온실가스에 대한 온실가스 배출량 산정에 적용한다.
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