MIL-PRF-55110J规定了刚性单板的性能和资格要求？双面的，双面的？带或不带电镀通孔的双面和多层印制电路板（见6.1）。通过使用两种产品保证方法之一（QPL或QPL/QML）完成验证。适用的主图纸中规定了对特定预期用途敏感的详细要求、特定特性和其他规定。

MIL-PRF-55110J establishes the performance and qualification requirements for rigid single?UOsided, double?UOsided, and multilayered printed wiring boards with or without plated through holes (see 6.1). Verification is accomplished through the use of one of two methods of product assurance (QPL or QPL/QML). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.