首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 IPC DR-572A
到馆提醒
收藏跟踪
购买正版
Drilling Guidelines for Printed Boards 印制板钻孔指南
发布日期: 2007-03-01
本文件提供了在由多种材料制成的印刷电路板(PCB)中生成高质量孔的指南。它涉及以下主题:钻头、工具、钻孔堆积材料、钻孔机、钻孔操作、钻孔质量和故障排除。
This document provides guidelines for generating good quality holes in printed circuit boards (PCBs) made from a wide variety of materials. It addresses the following topics: Drill Bits, Tooling, Drilling Stacked Materials, Drilling Machines, Drilling Operation, Drilled Hole Quality and Trouble Shooting.
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
SJ/T 11641-2016
印制板钻孔用盖板
Entry board for printed circuit board drilling
2016-04-05
现行
SJ/T 11660-2016
印制板钻孔用垫板
Backup board for printed circuit board drilling
2016-10-22
现行
GB/T 28248-2012
印制板用硬质合金钻头
Cemented carbide drills for printed boards
2012-03-09
现行
SJ/Z 21087-2016
印制板钻孔指南
Guide for drilling processing of printed circuit boards
2016-01-19
现行
IPC CH-65B
Guidelines for Cleaning of Printed Boards and Assemblies
印制板和组件清洁指南
2011-07-01
现行
IPC 1601A
Printed Board Handling and Storage Guidelines
印制板搬运和储存指南
2016-06-01
现行
IPC CM-770E
Component Mounting Guidelines for Printed Boards
印制板元件安装指南
2004-01-01
现行
IPC 5703
Cleanliness Guidelines for Printed Board Fabricators
印制板制造商的清洁指南
2013-05-01
现行
NAS 948
Printed Circuit Board Drilling Machine Numerically Controlled
印刷电路板数控钻床
1975-09-15
现行
GOST 20686-1975
Сверла комбинированные твердосплавные для печатных плат. Технические условия
硬质合金组合钻孔和埋头孔用于印刷电路板 规格
现行
IPC 4563
Resin Coated Copper Foil for Printed Boards Guideline
印制板用树脂涂覆铜箔指南
2007-11-01
现行
IPC D-279
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
可靠表面安装技术印制板组件的设计指南
1996-08-01
现行
IPC 5702
Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
原始设备制造商确定未填充印制板清洁度可接受水平的指南
2007-06-01
现行
IPC DR-570A
General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards
印制板用1/8英寸直径硬质合金柄钻通用规范
1994-04-01
现行
IPC D-322(R1991)
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
使用标准面板尺寸选择印刷线路板尺寸的指南
1984-09-01
现行
JEDEC JS 9704
IPC/JEDEC-9704: Printed Wiring Board (PWB) Strain Gage Test Guideline
IPC/JEDEC-9704:印制电路板(PWB)应变计测试指南
2005-06-01
现行
IPC 9194
Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
统计过程控制(SPC)在印制板组件制造指南中的应用
2004-09-01
现行
JEDEC JS 9704
IPC/JEDEC-9704: Printed Wiring Board (PWB) Strain Gage Test Guideline
IPC/JEDEC-9704:印制电路板(PWB)应变计测试指南
2005-06-01
现行
BS PD IEC/TR 61189-3-914-2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
电气材料、印制板和其他互连结构和组件的试验方法
2017-03-31
现行
KS C IEC TR 61189-3-914
전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제3-914부: 고휘도 LED용 인쇄회로기판의 열전도성 시험방법 — 지침
电气材料、印刷电路板和其他互连结构和组件的试验方法.第3-914部分:高亮度LED用印刷电路板的导热性试验方法.指南
2023-06-30