Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test methods for interconnection structures (printed boards)
电气材料、印制板和其他互连结构和组件的试验方法

2008-03-31

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Guidance for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法

2016-10-31

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Soldering flux for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用助焊剂

2015-04-30

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Soldering paste for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用焊膏

2015-04-30

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用助焊剂

2015-01-31

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用焊膏

2015-01-31

전기재료, 인쇄기판 및 기타 상호접속구조와 조립품 - 제3부 : 상호접속구조의 시험방법(인쇄기판)
试验方法电气材料 印刷电路板和其它互连结构和组件 - 第3部分:试验方法用于互连结构（印制电路板）

2009-12-01

Методы испытаний электрических материалов, печатных плат и других структур межсоединений и печатных узлов. Часть 3. Методы испытаний материалов для структур межсоединений (печатных плат)
电气材料 印刷电路板和其他互连结构和组件的测试方法 第3部分互连结构（印刷电路板）的测试方法

2013-11-14

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
电气材料、印刷电路板和其他互连结构和组件的试验方法.第3部分:互连结构（印刷电路板）的试验方法

2007-10-09

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board (IEC 91/1545/CD:2018); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-803部分:基材和印制板Z轴膨胀的试验方法（IEC 91/1545/CD:2018）；德语和英语文本

2019-05-01

Test methods for electrical materials, interconnection structures and assemblies-Test methods for printed board assemblies
电气材料、互连结构和组件的试验方法

2009-02-28

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
电气材料、印制板和其他互连结构和组件的试验方法.第2-803部分:基材和印制板Z轴膨胀的试验方法

2023-07-26

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第5-1部分:材料和组件的一般测试方法 - 印刷电路板组件的指导

2016-07-05

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test methods for materials for interconnection structures
电气材料、印制板和其他互连结构和组件的试验方法

2006-11-30

전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제5-2부: 재료 및 조립에 대한 일반 시험방법 — 인쇄기판 조립을 위한 땜질 플럭스
电气材料、印制板和其他互连结构和组件的试验方法.第5-2部分:材料和组件的一般试验方法.印制板组件用助焊剂

2023-06-30

전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제5-3부: 재료 및 조립에 대한 일반 시험방법 — 인쇄기판 조립을 위한 솔더 페이스트
电气材料、印制板和其他互连结构和组件的试验方法.第5-3部分:材料和组件的一般试验方法.印制板组件用焊膏

2023-06-30

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第5-3部分:材料和组件的一般测试方法 - 印刷电路板组件的焊膏

2015-01-08

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法第5-2部分:材料和组件的通用测试方法 - 印刷电路板组件的焊剂焊剂

2015-01-08

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
电气材料、印制板和其他互连结构和组件的试验方法

2017-03-31

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
电气材料、印制板和其他互连结构和组件的试验方法

2016-08-31