现行

SJ/Z 21297-2018

印制板图形成像指南
Guide of pattern imaging for printed circuit boards

2018-01-18

现行

SJ/Z 21281-2018

印制板表面安装盘图形设计指南
Design guide for surface mount land pattern of printed circuit boards

2018-01-18

现行

GB/T 29846-2013

印制板用光成像耐电镀抗蚀剂
Photoimageable plating and etching resist paste of printed circuit board

2013-11-12

现行

QJ 3015A-2012

印制电路板图形转移工艺技术要求
Technical requirements for printed circuit board pattern transfer

2013-01-04

现行

SJ/Z 21089-2016

印制板镀铜指南
Guide for copper plating of printed circuit boards

2016-01-19

现行

SJ/Z 21087-2016

印制板钻孔指南
Guide for drilling processing of printed circuit boards

2016-01-19

现行

SJ/Z 21299-2018

多层印制板压制指南
Guide of laminating for multilayer printed circuit boards

2018-01-18

现行

SJ/Z 21284-2018

印制板导通孔保护设计指南
Design guide for via protection of printed circuit boards

2018-01-18

现行

SJ/Z 21088-2016

印制板阻焊膜加工指南
Guide for solder mask processing of printed circuit boards

2016-01-19

现行

SJ/Z 21300-2018

印制板电镀镍金加工指南
Guide of nickel and goId plating for printed circuit boards

2018-01-18

现行

SJ/Z 21296-2018

印制板用照相底版制作和使用指南
Guide of phototool generation and use for printed circuit boards

2018-01-18

现行

SJ/Z 21295-2018

多层印制板用芯板选用指南
Guide of selecting core constructions for multilayer printed circuit boards

2018-01-18

现行

SJ/Z 21090-2016

印制板热风整平指南
Guide for hot air solder level processing of printed circuit boards

2016-01-19

现行

SJ/Z 21301-2018

印制板油墨标识加工指南
Guide fo r ink mark processing of printed circuit boards

2018-01-18

现行

IEEE 2716-2022

IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
IEEE印制电路板级屏蔽效能表征指南草案

2023-05-29

现行

GB/T 36504-2018

印刷线路板表面污染物分析 俄歇电子能谱
Guide for the analysis of the printed circuit board surface contamination—Auger electron spectroscopy

2018-07-13

现行

MIL MIL-C-55302/51 Notice 1-Cancellation

CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: CARD GUIDE FOR SOCKET MOUNTING, FOR MULTILAYERED PRINTED WIRING BOARDS (NO S/S DOCUMENT)
连接器、印刷电路组件和附件:多层印刷线路板插座安装卡指南（无S/S文件）

1979-09-07

现行

MIL MIL-DTL-55302/145C Amendment 2(all prev amd incorp.)

Connectors, Printed Circuit Subassembly and Accessories, Receptacle with Pin Contacts, 2 Female Keying Guides, 2.114 Inches Length, for Printed Wiring Boards (.100 Inch Spacing)
连接器 印刷电路组件和附件 带引脚触点的插座 2个母键导轨 2.114英寸长 用于印刷线路板（.100英寸间距）

2012-11-30

现行

MIL MIL-DTL-55302/145C Amendment 1(amendment incorporated)

Connectors, Printed Circuit Subassembly and Accessories, Receptacle with Pin Contacts, 2 Female Keying Guides, 2.114 Inches Length, for Printed Wiring Boards (.100 Inch Spacing)
连接器 印刷电路组件和附件 带引脚触点的插座 2个母键导轨 2.114英寸长 用于印刷线路板（.100英寸间距）

2011-03-16

现行

MIL MIL-C-55302/143B

CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE WITH SOCKET CONTACTS, 3 KEYING GUIDES, FOR PRINTED WIRING BOARDS (.100 INCH SPACING) (SUPERSEDING MIL-C-55302/143A)
连接器 印刷电路组件和附件:带插座触点的插座 3个键盘导轨 用于印刷电路板（.100英寸间距）（代替MIL-C-55302/143A）

1988-11-17