IEC 60811-411:2012给出了评估低温脆性的程序，该程序通常适用于用于通信和光缆的填充化合物。IEC 60811-411:20 12取消并取代已撤回的IEC 60811-5-1:19 90第6条。IEC 60811-100:2012附录A中显示了替换件的全部详细信息。与上一版本相比没有具体的技术变化，但请参见IEC 60811-100:2012的前言。 本出版物应与IEC 60811-100:2012一起阅读。

IEC 60811-411:2012 gives the procedure to evaluate lower temperature brittleness which typically applies to filling compounds used for communication and optical fibre cables. IEC 60811-411:2012 cancels and replaces Clause 6 of IEC 60811-5-1:1990, which is withdrawn. Full details of the replacements are shown in Annex A of IEC 60811-100:2012. There are no specific technical changes with respect to the previous edition, but see the Foreword to IEC 60811-100:2012.

This publication is to be read in conjunction with IEC 60811-100:2012.