间距、体积和密度困扰着裸板测试工程师。HDI印刷电路板无法通过传统的“钉床”测试。新的非接触测试技术、飞针测试和更好的测试设计方法是IPC第一届全国裸板和高级基板电气测试会议的主题之一。

Pitch, volume and density are bedeviling the bare board test engineer. HDI printed circuit boards defy conventional "bed of nails" testing. New, non-contact test technologies, flying probe testing and better methods of designing for test are some of the topics covered in IPC's first National Conference on Bare Board and Advanced Substrate Electrical Test.