MIL-PRF-31032/5C涵盖了刚性多层（三层或三层以上导体）印制电路板（以下简称印制电路板）的一般性能要求，该印制电路板具有电镀孔，由热塑性基材制成，将使用焊接进行组件/零件安装（见6.1.1）。还包括含有热塑性和热固性树脂基材的混合基材印制板。印制板可能包含内部金属芯或外部散热器。

MIL-PRF-31032/5C covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic base materials, that will use soldering for component/part mounting (see 6.1.1). Mixed base material printed boards containing both thermoplastic and thermosetting resin base materials are also covered. The printed board may contain an internal metal core or external heat sink.