现行

JIS C 6482-1997

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
印制线路板用覆铜层压板纸基环氧树脂

1997-01-01

现行

BS EN 60249-2-3-1994

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

现行

MIL MIL-S-13949/31 Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
片材 印刷线路板 层压 基材BI（非织造芳纶增强材料 聚酰亚胺树脂 金属包覆或未包覆）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/31

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
基材BI（非织造芳纶增强、聚酰亚胺树脂、金属包覆或非包覆）层压印刷线路板薄板（无S/S文件）

1994-03-17

现行

MIL MIL-P-13949/8D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GT 玻璃基 WOVEN 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/8C）（NO S/S文件）

1988-03-28

现行

MIL MIL-P-13949/8D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
覆铜箔阻燃聚四氟乙烯树脂编织玻璃基GT基材金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/8C）（无S/S文件）

1988-03-28

现行

JIS C 6483-1997

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
印制线路板用覆铜层压板合成纤维织物基环氧树脂

1997-01-01

现行

MIL MIL-P-13949/6D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/6C）（无S/S文件）

1994-07-11

现行

MIL MIL-P-13949/6D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GP 玻璃基 非织造布 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/6C）（无S/S文件）

1987-02-11

现行

MIL MIL-P-13949/6D Notice 2-Inactivation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/6C）（无S/S文件）

1997-08-01

现行

MIL MIL-P-13949/6D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
覆铜阻燃聚四氟乙烯树脂无纺布基材GP玻璃基金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/6C）（无S/S文件）

1987-02-11

现行

MIL MIL-P-13949/7E Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GF 玻璃基 无纺 聚四氟乙烯树脂 阻燃 微波应用 覆铜（取代MIL-P-13949/7D）（无文件）

1994-07-11

现行

MIL MIL-P-13949/14A Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GY 玻璃基编织 聚四氟乙烯树脂 阻燃 微波应用 覆铜（取代MIL-P-13949/14）（无S/S文件）

1994-07-11

现行

MIL MIL-P-13949/14A Notice 2-Inactivation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GY 玻璃基编织 聚四氟乙烯树脂 阻燃 微波应用 覆铜（取代MIL-P-13949/14）（无S/S文件）

1997-08-01

现行

MIL MIL-P-13949/14A Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
塑料板 层压板 金属层（印刷线路板） 基材GY 玻璃基板 聚四氟乙烯树脂 耐火材料 用于微波应用 铜箔（取代MIL-P-13949/14）（NO S/S文件）

1987-02-11

现行

MIL MIL-P-13949/7E Notice 02118-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GF 玻璃基 无纺 聚四氟乙烯树脂 阻燃 微波应用 覆铜（取代MIL-P-13949/7D）（无文件）

1998-11-30

现行

MIL MIL-P-13949/14A

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
微波应用用覆铜层压金属覆层塑料板（用于印制线路板） 基材GY 玻璃基编织 聚四氟乙烯树脂 阻燃（取代MIL-P-13949/14）（无S/S文件）

1987-02-11

现行

MIL MIL-P-13949/7E

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
微波应用用覆铜层压金属覆层塑料板（用于印制线路板） 基材GF 玻璃基 无纺布 聚四氟乙烯树脂 阻燃（代替MIL-P-13949/7D）（无S/S文件）

1987-02-11

现行

BS 4584-103.1-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 多层印制板制造中用作粘合片材料的预浸料规范

1990-02-28

现行

SJ 20224-1992

印制线路板用阻燃型覆铜箔环氧玻璃布层压板详细规范
Detail specification for epoxide woven glass fabric copper-clad laminated sheets of flammability resistance for printed wiring boards

1992-11-19