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现行 MIL MIL-PRF-31032/3D
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Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting 挠性印刷线路板 单层和双层 带或不带电镀通孔 带或不带加强筋 用于焊接部件安装
发布日期： 2020-04-03
MIL-PRF-31032/3D涵盖了柔性、单面和双面（一层或两层导体）印制电路板（以下简称印制电路板）的一般性能要求，该印制电路板带有或不带有电镀孔，以及带有或不带有用于元件/零件安装的焊接加强件（见6.1.1）。
MIL-PRF-31032/3D covers the generic performance requirements for flexible, single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes and with or without stiffeners that will use soldering for component/part mounting (see 6.1.1).
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发布单位或类别： 美国-美国军事规范和标准
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研制信息
相似标准/计划/法规
现行
JIS C 5017-1994
Flexible printed wiring boards -- Single-sided, Double-sided
柔性印制线路板单面、双面
1994-01-01
现行
BS DD IEC/PAS 62326-7-1-2007
Performance guide for single- and double-sided flexible printed wiring boards
单面和双面柔性印制电路板的性能指南
2007-06-29
现行
BS 6221-8-1982
Printed wiring boards-Method for specifying single and double sided flexible printed wiring boards with through connections
印刷线路板 带贯穿连接的单面和双面挠性印制电路板的规定方法
1982-10-29
现行
BS 6221-7-1982
Printed wiring boards-Method for specifying single and double sided flexible printed wiring boards without through connections
印刷线路板 无贯穿连接的单面和双面柔性印制电路板的规定方法
1982-10-29
现行
IPC 6202
Performance guide Manual for single- and double-sided flexible printed wiring boards
单面和双面柔性印制电路板的性能指南手册
1999-10-01
现行
MIL MIL-PRF-31032/3C Amendment 1
Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强筋
2018-06-13
现行
MIL MIL-PRF-31032/3A Amendment 3
Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-Through Holes, with or without Stiffeners for Soldered Part Mounting
软性印刷线路板 单层和双层 带或不带电镀通孔 有或不带焊接部件安装用加强件
2008-04-23
现行
MIL MIL-PRF-31032/3B Amendment 1(amendment incorporated)
Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强筋
2012-11-03
现行
MIL MIL-PRF-31032/3A Amendment 4(all prev amd incorp.)
Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强筋
2009-06-10
现行
MIL MIL-PRF-31032/3A Amendment 2
PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENERS FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/3)
单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强件 用于焊接部件安装（代替MIL-PRF-31032/3）
2006-10-31
现行
MIL MIL-PRF-31032/3A Amendment 1
PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENERS FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/3)
单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强件 用于焊接部件安装（代替MIL-PRF-31032/3）
2006-02-24
现行
MIL MIL-PRF-31032/2D
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷线路板 刚性 单层和双层 热固性树脂基材 带或不带电镀通孔 用于焊接部件安装
2020-03-02
现行
MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷接线板 刚性 单层和双层 热固性树脂基材 带或不带电镀孔 用于焊接部件安装
2009-07-04
现行
MIL MIL-PRF-31032/2C Amendment 1
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板
2018-06-12
现行
MIL MIL-PRF-31032/2A Amendment 3
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基材刚性单层和双层印刷线路板
2008-04-23
现行
MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板
2012-11-02
现行
MIL MIL-PRF-31032/2A Amendment 2
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
焊接部件安装用刚性单层和双层热固性树脂基材印刷线路板 带或不带电镀通孔（代替MIL-PRF-31032/2）
2006-10-31
现行
MIL MIL-PRF-31032/2A Amendment 1
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
印刷接线板 刚性 单层和双层 热固性树脂基材 带或不带孔 用于焊接部分安装（取代MIL-PRF-31032/2）
2006-02-24
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