本推荐规程旨在提供有关波峰焊程序的建议。详细建议基于制造经验和实验室实验。这些建议反映了在为关键通信或控制系统生产功能电子模块方面最有效的设计实践和制造程序。电子模块包括组件、组件和印刷电路板（PC）或印刷线路板（PW）。在下文中，对印刷电路板（PC）的引用应解释为包括印刷线路板（PW）。

The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards. In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.