本文件建立了IC、模块和PCBA抗扰度扫描的测试方法。近场抗扰度扫描的结果与系统级行为有关，但无法使用IEC 61000-4-2测试方法预测系统级性能。原因是注入点和局部电流密度之间的耦合路径以及耦合到记录道或IC中的相关场存在变化。该测试方法侧重于软故障，如误码和干扰，记住快速脉冲也可能导致锁存- 向上的该文件将指导用户识别组件（如IC、模块和PCBA）中ESD引起的软故障的根本原因，以进行调试和质量控制。

This document establishes a test method for immunity scanning of ICs, modules, and PCBAs. Results from near-field immunity scanning relate to the system level behavior but cannot predict system level performance using the IEC 61000-4-2 test method. The reason is that variations exist in coupling paths between injection points and local current densities and associated fields coupled into traces or ICs.This test method focuses on soft failures, such as bit errors and upsets, keeping in mind that fast pulses can also cause latch-up. The document will guide the user in identifying the root causes of ESD induced soft failures in components, such as ICs, modules, and PCBAs, for debugging and quality control purposes.