IEC 61188的本部分规定了从接地模式设计的角度对SMD尺寸图的一般要求。 本文件的目的是防止因缺乏信息和/或误用SMD外形图中的信息而导致的接地模式设计问题，并提高IEC 61188系列的利用率。 本文件适用于半导体器件和电气元件的SMD。交叉引用:IEC 60194-2IEC 60194EN 61188-5-4IEC 61188-5-3IEC 60191-1EN 61188-5-8IEC 60191-6-1IEC 61188-5-6IEC 61188-5-2EN 61191-2IEC 61188-5-5IPC-A-6101FIEC 61191-2IPC-2221BEN 60191-6-1IEC 60191-6EN 61188-5-2IEC 61188-5-1IEC 61188-5-1EN 61188-5-1EN 61188-5-1EN 61188-1EN 61188-5-1EN 61188-5-1EN 61188-1EN 61188-5-1EN 61188-1EN 61188-5-1EN 6118-1EN 61188-1EN 61188-1EN 6118-1EN 6118-1EN 6118-1EN 6118购买本文件时包括购买费用。

This part of IEC 61188 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.Cross References:IEC 60194-2IEC 60194EN 61188-5-4IEC 61188-5-3IEC 60191-1EN 61188-5-1IEC 61188-5-8IEC 60191-6-1IEC 61188-5-6IEC 61188-5-2EN 61191-2IEC 61188-5-5IPC-A-610FIEC 61191-2IPC-2221BEN 60191-6-1IEC 60191-6EN 60191-6EN 61188-5-2IEC 61188-5-4IEC 61188-5-1EN 61188-5-8EN 61188-5-3EN IEC 61191-1EN 61188-5-5EN IEC 60191-1IEC 61191-1EN 61188-5-6All current amendments available at time of purchase are included with the purchase of this document.