现行

IEC 62047-20-2014

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
半导体器件微机电器件第20部分:陀螺仪

2014-06-26

现行

IEC 62047-19-2013

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
半导体器件 - 微机电器件 - 第19部分:电子罗盘

2013-07-17

现行

IEC 62047-1-2016

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
半导体器件 - 微机电器件 - 第1部分:术语和定义

2016-01-06

现行

GB/T 42709.19-2023

半导体器件 微电子机械器件 第19部分：电子罗盘
Semiconductor devices—Micro-electromechanical devices—Part 19: Electronic compasses

2023-08-06

现行

IEC 62047-40-2021

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
半导体器件.微机电器件.第40部分:微机电惯性冲击开关阈值的试验方法

2021-09-03

现行

IEC 62047-5-2011

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
半导体器件 - 微机电器件 - 第5部分:RF MEMS开关

2011-07-13

现行

IEC 62047-4-2008

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
半导体器件 - 微机电器件第4部分:Mems的通用规范

2008-08-21

现行

GB/T 42709.5-2023

半导体器件 微电子机械器件 第5部分：射频MEMS开关
Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches

2023-05-23

现行

IEC 62047-10-2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
半导体器件 - 微机电器件 - 第10部分:MEMS材料的微柱压缩测试

2011-07-26

现行

IEC 62047-33-2019

Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
半导体器件微机电器件第33部分:MEMS压阻压敏器件

2019-04-05

现行

IEC 62047-43-2024

Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
半导体器件.微机电器件.第43部分:柔性微机电器件循环弯曲变形后电气特性的试验方法

2024-03-19

现行

IEC 62047-41-2021

Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
半导体器件.微机电器件.第41部分:RF MEMS环行器和隔离器

2021-06-15

现行

IEC 62047-26-2016

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
半导体器件 - 微机电器件 - 第26部分:微沟槽和针结构的描述和测量方法

2016-01-07

现行

IEC 62047-13-2012

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
半导体器件 - 微机电器件 - 第13部分:测量MEMS结构的粘合强度的弯曲和剪切型测试方法

2012-02-28

现行

BS 10/30211454 DC

BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures
英国标准EN 62047-13 半导体器件 微型机电设备 第13部分 测量MEMS结构粘接强度的弯曲和剪切试验方法

2010-02-22

现行

IEC 62047-11-2013

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
半导体器件 - 微机电器件 - 第11部分:用于微机电系统的自由立体材料的线性热膨胀系数的测试方法

2013-07-17

现行

IEC 62047-22-2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件微机电器件第22部分:柔性衬底上导电薄膜的机电拉伸试验方法

2014-06-19

现行

IEC 62047-18-2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
半导体器件 - 微机电器件 - 第18部分:薄膜材料的弯曲测试方法

2013-07-17

现行

IEC 62047-32-2019

Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
半导体器件微机电器件第32部分:MEMS谐振器非线性振动的试验方法

2019-01-24

现行

KS C IEC 62047-18

반도체 소자 ― 초소형 전기기계소자 ― 제18부: 박막 재료의 굽힘 시험방법
半导体器件 - 微机电装置 - 第18部分:薄膜材料弯曲试验方法

2016-12-29