IEC 61191-3:20 17(E)规定了引线和孔焊料组件的要求。这些要求涉及完全使用通孔安装技术（THT）的那些组件，或包括其他相关技术（即表面安装、芯片安装、端子安装）的那些组件的THT部分。 与上一版相比，此版本包括以下重大技术变更: a）已更新要求，以符合IPC-A-610F中的验收标准。

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.