现行

GB/T 4725-2022

印制电路用覆铜箔环氧玻纤布层压板
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits

2022-03-09

现行

JIS C 6489-1999

Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的环氧无纺布/玻璃纤维增强覆铜层压板（垂直燃烧试验）

1999-01-01

现行

JIS C 6492-1998

Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃布覆铜层压板（垂直燃烧试验）

1998-01-01

现行

UNE-EN 60249-2-4/A3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板

1996-11-07

现行

UNE-EN 60249-2-4-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板

1996-11-07

现行

JIS C 6494-1999

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基材多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1999-01-01

现行

UNE-EN 60249-2-4/A4-1996

BASE MATERIAL FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板

1996-11-07

现行

BS EN 61249-2-6-2003

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料 加固基材 包覆和未包覆 规定可燃性的包铜溴化环氧无纺/编织E玻璃纤维增强层压板（垂直燃烧试验）

2006-08-31

现行

UNE-EN 60249-2-10-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILIY (VERTICAL BURNING TEST).
印刷电路的基材 第2部分:规范 规范10:规定易燃性的环氧无纺/玻璃纤维编织增强覆铜层压板（垂直燃烧试验）

1996-07-24

现行

UNE-EN 60249-2-5-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº5: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
印刷电路的基材 第2部分:规范 规范5:规定可燃性的环氧玻璃纤维织物覆铜层压板（垂直燃烧试验）

1996-11-07

现行

KS C IEC 60249-2-11(2017 Confirm)

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板

2002-08-31

现行

KS C IEC 60249-2-11(2022 Confirm)

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印刷电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃织物覆铜层压板

2002-08-31

现行

JIS C 6488-1999

Base materials for printed circuits -- Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的环氧纤维素纸芯、环氧玻璃布表面覆铜层压板（垂直燃烧试验）

1999-01-01

现行

UNE-EN 60249-2-12-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范12:多层印制板制造用规定可燃性的薄环氧玻璃纤维织物覆铜层压板

1996-07-24

现行

BS EN 61249-2-26-2005

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2005-10-07

现行

BS EN 61249-2-39-2013

Materials for printed boards and other interconnecting structures-Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料

2013-04-30

现行

UNE-EN 60249-2-11-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范11:用于制造多层印制板的通用级薄环氧玻璃纤维织物覆铜层压板

1996-07-24

现行

JIS C 6490-1998

Base materials for printed circuits -- Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的聚酰亚胺玻璃纤维织物覆铜层压板（垂直燃烧试验）

1998-01-01

现行

BS EN 61249-2-22-2005

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2005-08-24

现行

BS EN 61249-2-21-2003

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2004-02-16