新的！IEC TR 62240-1:20 18作为IEC TR 62240-1:20 18 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC TR 62240-1:20 18是一份技术报告，提供了在比器件制造商规定的温度范围更宽的温度范围内使用半导体器件时的信息。当没有合理的替代方案可用时，本文描述的升级解决方案被视为例外；否则，在制造商的规范范围内使用器械。本文件描述了用于实现这种热升级的特殊情况的方法和过程。这些方法和过程的所有元素都采用了现有的、常用的最佳工程实践。遵循这些过程不需要新的或独特的工程知识，只需要严格应用整体方法。术语“升级”和“热升级”在航空电子工业讨论和会议中越来越多地使用，明确的定义包括在本IEC技术报告中。它们是作为通常用于电路设计的电子元件选择方法的特殊情况的速记参考而创造的。这一新版本取消并取代了2013年发布的第一版，并包括第4.1款（选择条款介绍）和相关流程图的修订措辞。

NEW!IEC TR 62240-1:2018 is available as IEC TR 62240-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers’ specifications. This document describes the methods and processes for implementing this special case of thermal uprating. All of the elements of these methods and processes employ existing, commonly used best engineering practices. No new or unique engineering knowledge is needed to follow these processes, only a rigorous application of the overall approach. The terms “uprating” and “thermal uprating” are being used increasingly in avionics industry discussions and meetings, and clear definitions are included in the present IEC Technical Report. They were coined as shorthand references to a special case of methods commonly used in selecting electronic components for circuit design. This new edition cancels and replaces the first edition published in 2013 and includes a revised wording for subclause 4.1 (Introduction to selection provisions) and the associated flowchart.