IEC 60115-2:20 23(E)适用于电子设备中使用的带端接引线的固定低功率薄膜电阻器，这些电阻器通常采用通孔技术(THT)组装在电路板上。 这些电阻器通常根据类型（不同的几何形状）和样式（不同的尺寸）以及产品技术来描述。这些电阻器的电阻元件通常由保形漆涂层保护。这些电阻器具有导线终端，主要用于以通孔技术安装在电路板上。 本文件的目的是说明优选的额定值和特性，从IEC 60115-1中选择适当的质量评估程序、测试和测量方法，并给出此类电阻器的一般性能要求。与上一版相比，此版本包括以下重大技术变更: 通用规范IEC 60115中产品技术和产品分类级别的定义？1:20 20，已获采纳； 已经审查了表1中给出的优选尺寸，并且已经删除了遗留样式RA_0922； 4.2中修改了轴向引线电阻器引线偏心度可选规范的依据； IEC 60115的“周期脉冲高压过载试验”？1:20 20，8.3已被采用为5.3.8中的默认测试方法，从而取代IEC 60115的传统测试“周期脉冲过载测试”？1:2020,8.4; IEC 60115修订后的可焊性试验？1:20 20，11.1已于5.3.19和5.3.20采用； IEC 60115的组合耐溶剂试验？1:2020，11.3已于5.3.22采用； IEC 60115的“室温耐久性试验”？1:20 20，7.2（先前的IEC 60115 2:20 14，附录C）已作为5.4.1中的可选试验采用； IEC 60115 1:20 20，8.2的“单脉冲高压过载试验”，在5.3.7中应用脉冲形状10/700，由5.4.2中脉冲形状1，2/50提供的可选替代方案补充； IEC 60115“低温运行”的气候试验？1:20 20，10.2，以及IEC 60115的“湿热、稳态、加速”？1:20 20，10.5，已分别作为5.4.4和5.4.5中的可选测试； 关于稳定性要求及其允许的绝对和相对偏差的表述，在6.2中提供了新的指导； 在6中增加了目视检查的验收标准。5和附件B； 在6.5.2和7.2中增加了内包装和邻近包装的目视检查； 9.8中增加了终端镀层的定期评估作为质量评估的新课题； IEC 60115修订后的测试条款编号？1:20 20已应用； 增加了一个新的附录C，以总结组装含铅薄膜电阻器的工艺要求，例如在先前的IEC 61192系列标准中给出的要求； 关于径向成形样式的资料性附件F（先前的附件B）已被修改，详细说明了用于表面贴装装配的成形Z形弯曲样式。

IEC 60115-2:2023(E) is applicable to fixed low-power film resistors with termination leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards.
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique.
The object of this document is to state preferred ratings and characteristics and to select from IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.
This edition includes the following significant technical changes with respect to the previous edition:

1. the definitions of product technologies and product classification levels of the generic specification, IEC 60115？1:2020, have been adopted;
2. the preferred dimensions given in Table 1 have been reviewed, and the legacy style RA_0922 has been removed;
3. a basis for the optional specification of the lead eccentricity of axial leaded resistors has been amended in 4.2;
4. the 'period-pulse high-voltage overload test' of IEC 60115？1:2020, 8.3 has been adopted as default test method in 5.3.8, thereby replacing the legacy test 'periodic-pulse overload test' of IEC 60115？1:2020, 8.4;
5. the revised solderability test of IEC 60115？1:2020, 11.1 has been adopted in 5.3.19 and 5.3.20;
6. the combined solvent resistance test of IEC 60115？1:2020, 11.3 has been adopted in 5.3.22;
7. the 'endurance at room temperature test' of IEC 60115？1:2020, 7.2 (prior IEC 60115 2:2014, Annex C) has been adopted as an optional test in 5.4.1;
8. the 'single-pulse high-voltage overload test' of IEC 60115 1:2020, 8.2, applied with the pulse shape 10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse shape 1,2/50 in 5.4.2;
9. climatic tests for 'operation at low temperature' of IEC 60115？1:2020, 10.2, and for 'damp heat, steady state, accelerated' of IEC 60115？1:2020, 10.5, have been adopted as optional tests in 5.4.4 and 5.4.5, respectively;
10. new guidance is provided in 6.2 on the presentation of stability requirements with their permissible absolute and relative deviations;
11. acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
12. visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2;
13. the periodical evaluation of termination platings has been added as a new topic of quality assessment in 9.8;
14. the revised test clause numbering of IEC 60115？1:2020 has been applied;
15. a new Annex C has been added to summarize workmanship requirements for the assembly of leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
16. the informative Annex F (prior Annex B) on radial formed styles has been amended with details on a formed Z-bend style for surface-mount assembly.