现行

BS EN 62047-18-2013

Semiconductor devices. Micro-electromechanical devices-Bend testing methods of thin film materials
半导体器件 微机电设备

2013-10-31

现行

BS EN 62047-2-2006

Semiconductor devices. Micro-electromechanical devices-Tensile testing method of thin film materials
半导体器件 微机电设备

2006-11-30

现行

BS EN 62047-22-2014

Semiconductor devices. Micro-electromechanical devices-Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件 微机电设备

2014-10-31

现行

BS EN 62047-6-2010

Semiconductor devices. Micro-electromechanical devices-Axial fatigue testing methods of thin film materials
半导体器件 微机电设备

2010-04-30

现行

BS EN 62047-17-2015

Semiconductor devices. Micro-electromechanical devices-Bulge test method for measuring mechanical properties of thin films
半导体器件 微机电设备

2015-07-31

现行

BS EN 62047-21-2014

Semiconductor devices. Micro-electromechanical devices-Test method for Poisson's ratio of thin film MEMS materials
半导体器件 微机电设备

2014-10-31

现行

IEC 62047-18-2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
半导体器件 - 微机电器件 - 第18部分:薄膜材料的弯曲测试方法

2013-07-17

现行

IEC 62047-2-2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
半导体器件 - 微机电器件 - 第2部分:薄膜材料的拉伸测试方法

2006-08-15

现行

KS C IEC 62047-18

반도체 소자 ― 초소형 전기기계소자 ― 제18부: 박막 재료의 굽힘 시험방법
半导体器件 - 微机电装置 - 第18部分:薄膜材料弯曲试验方法

2016-12-29

现行

KS C IEC 62047-22

반도체 소자 ― 초소형 전기기계소자 ― 제22부: 유연 기판의 전도성 박막용 전기기계 인장 시험방법
半导体器件 - 微机电装置 - 第18部分:薄膜材料弯曲试验方法

2016-12-29

现行

KS C IEC 62047-18(2021 Confirm)

반도체 소자 ― 초소형 전기기계소자 ― 제18부: 박막 재료의 굽힘 시험방법
半导体器件微机电器件第18部分:薄膜材料弯曲试验方法

2016-12-29

现行

KS C IEC 62047-22(2021 Confirm)

반도체 소자 ― 초소형 전기기계소자 ― 제22부: 유연 기판의 전도성 박막용 전기기계 인장 시험방법
半导体器件微机电器件第18部分:薄膜材料弯曲试验方法

2016-12-29

现行

BS IEC 62047-29-2017

Semiconductor devices. Micro-electromechanical devices-Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
半导体器件 微机电设备

2018-03-15

现行

IEC 62047-22-2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件微机电器件第22部分:柔性衬底上导电薄膜的机电拉伸试验方法

2014-06-19

现行

BS EN 62047-8-2011

Semiconductor devices. Micro-electromechanical devices-Strip bending test method for tensile property measurement of thin films
半导体器件 微机电设备

2011-06-30

现行

BS IEC 62047-36-2019

Semiconductor devices. Micro-electromechanical devices-Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
半导体器件 微机电设备

2019-04-24

现行

IEC 62047-3-2006

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
半导体器件 - 微机电器件 - 第3部分:薄膜标准试件用于拉伸试验

2006-08-15

现行

IEC 62047-6-2009

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
半导体器件 - 微机电器件 - 第6部分:薄膜材料的轴向疲劳试验方法

2009-04-07

现行

BS IEC 62047-30-2017

Semiconductor devices. Micro-electromechanical devices-Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
半导体器件 微机电设备

2017-10-09

现行

IEC 62047-21-2014

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
半导体器件微机电器件第21部分:薄膜MEMS材料泊松比的试验方法

2014-06-19