IEC 60749的本部分描述了一种用于确定封装固态 用于通孔安装的设备可以承受安装温度的影响 在使用波峰焊焊接引线的过程中，它们会受到影响。 为了建立最具重现性的方法的标准测试程序，焊料 采用倾角法是因为其条件更可控。本程序确定 设备是否能够承受印刷过程中遇到的焊接温度 接线板组装操作，不会降低其电气特性或内部 连接。 该试验具有破坏性，可用于鉴定、批量验收和作为产品使用 班长 热量通过引线传导到器件封装中，从封装处的焊接热开始 板的背面。本程序不模拟波峰焊或回流焊加热 与包装体在同一侧的板上曝光。购买本文件时可获得的所有当前修订均包含在购买本文件中。

This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body.All current amendments available at time of purchase are included with the purchase of this document.