System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的柔性单面和双面印制板

2001-12-17

System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
质量评估体系 能力详细说明 带普通孔的刚性单面和双面印制板

2001-12-17

System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
质量评估体系 能力详细说明 无贯穿连接的柔性单面和双面印制板

2001-12-17

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes
电子元件质量评定协调体系 性能详细规范:带普通孔的单面和双面印制板

1998-06-15

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
电子元件质量评定协调体系 性能详细规范:带普通孔的单面和双面印制板

1996-04-15

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED BOARDS WITH PLAIN HOLES
印制板 带平孔的单面和双面板规范

1983-07-15

Capability detail specification: single and double sided printed boards with plated-through holes; german version EN 123200-800:1992
能力详细规范:带电镀通孔的单面和双面印制板；德文版EN 123200-800:1992

1992-11-01

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes
电子元件质量评定协调体系 能力详细规范:带电镀通孔的单面和双面印制板

1998-06-15

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
电子元件质量评定协调体系 能力详细规范:带电镀通孔的单面和双面印制板

1996-04-15

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
印制板 带贯穿连接的单面和双面柔性印制板规范

1985-12-15

单、双面挠性印制板分规范
Sectional specification for single and double sided flexible printed board

2019-03-25

航天用刚性单双面印制电路板规范
Specification for rigid single-sided and double-sided printed circuit board of aerospace

2013-01-04

System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的挠性刚性双面印制板

2001-12-17

System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
质量评估体系 能力详细说明 带电镀通孔的刚性双面印制板

2001-12-17

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED BOARDS WITH PLATED-THROUGH HOLES
印制板 带电镀通孔的单面和双面板规范

1985-11-15

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
印制板 无贯穿连接的单面和双面柔性印制板规范

1985-10-15

Платы печатные одно- и двусторонние с неметаллизированными отверстиями. Общие технические требования
单面和双面印刷板 带平孔 一般规格

Printed wiring boards-Specification for single and double sided rigid printed boards with plated-through holes
印刷线路板 带电镀通孔的单面和双面刚性印制板规范

1982-01-29

Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
电子元件质量评定协调体系 性能详细规范:带贯穿连接的挠性-刚性双面印制板

1998-06-15

IEC 2326-3-1. Printed boards. Part 3. Rigid single and double sided printed boards with interlayer connections. Section 1. Capability detail specification. Performance level A, B, and C. 52/677/CD. Capability detail specification - Performance levels A, B and C
IEC 2326-3-1 印制板 第三部分 带有夹层连接的刚性单面和双面印制板 第一节 能力详细说明 性能等级A、B和C 52/677/CD 能力详细规范-性能等级A、B和C

1996-10-15