Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Measurement of melting temperature or melting temperature ranges of solder alloys
电气材料、印制板和其他互连结构和组件的试验方法
发布日期:
2013-07-31
交叉引用:IEC 60194EN 60194IEC 61189-3EN 61189-3IEC 61190-1-3EN 61190-1-3ISO 9453EN ISO 9453ISO 11357-1EN ISO 11357-1IEC 61189-1购买本文件时提供的所有现行修订均包含在购买本文件中。
Cross References:IEC 60194EN 60194IEC 61189-3EN 61189-3IEC 61190-1-3EN 61190-1-3ISO 9453EN ISO 9453ISO 11357-1EN ISO 11357-1IEC 61189-1All current amendments available at time of purchase are included with the purchase of this document.