现行

BS 6221-6-1982

Printed wiring boards-Specification for multilayer printed wiring boards
印刷线路板 多层印制线路板规范

1982-01-29

现行

JIS C 6521-1996

Test methods of prepreg for multilayer printed wiring boards
多层印制线路板用预浸料的试验方法

1996-01-01

现行

JIS C 6520-1993

General rules of prepreg for multilayer printed wiring boards
多层印制线路板用预浸料通则

1993-01-01

现行

BS 6221-11-1991

Printed wiring boards-Specification for flex-rigid multilayer printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性多层印制板规范

1991-08-30

现行

UNE 20621-6-1985

PRINTED BOARDS. SPECIFICATION FOR MULTILAYER PRINTED BOARDS
印制板 多层印制板规范

1985-10-15

现行

BS 6221-9-1991

Printed wiring boards-Specification for flexible multilayer boards with through connections
印刷线路板 带贯穿连接的挠性多层板规范

1991-09-30

现行

BS 6221-12-1992

Printed wiring boards-Specification for mass lamination panels (semi-manufactured multilayer printed boards)
印刷线路板 大规模层压板（半成品多层印制板）规范

1992-11-15

现行

KS C 6458(2017 Confirm)

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
预浸料多层印刷线路板（环氧树脂浸渍玻璃布）

1997-08-19

现行

KS C 6458(2022 Confirm)

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
多层印刷线路板用预浸料（环氧树脂浸渍玻璃布）

1997-08-19

现行

JIS C 6522-1996

Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth
多层印制线路板用预浸料环氧树脂浸渍玻璃布

1996-01-01

现行

BS EN 62326-4-1997

Printed boards-Rigid multilayer printed boards with interlayer connections. Sectional specification
印制板 带有夹层连接的刚性多层印制板 分规范

1997-06-15

现行

GB/T 4588.4-2017

刚性多层印制板分规范
Sectional specification for rigid multilayer printed boards

2017-07-31

现行

QJ 832B-2011

航天用多层印制电路板试验方法
Test method of multilayer printed board for aerospace

2011-07-19

现行

QJ 831B-2011

航天用多层印制电路板通用规范
General specification for multilayer printed board for aerospace

2011-07-19

现行

SJ/Z 21299-2018

多层印制板压制指南
Guide of laminating for multilayer printed circuit boards

2018-01-18

现行

BS 6221-20-1984

Printed wiring boards-Guide for the assembly of printed wiring boards
印刷线路板 印制线路板组装指南

1984-04-30

现行

BS 6221-3-1991

Printed wiring boards-Guide for the design and use of printed wiring boards
印刷线路板 印制线路板的设计和使用指南

1991-08-30

现行

JIS C 6523-1995

Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth
多层印制线路板用预浸料改性或未改性聚酰亚胺树脂浸渍玻璃布

1995-01-01

现行

JIS C 6524-1995

Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth
多层印制线路板用预浸料双马来酰亚胺/三嗪/环氧树脂浸渍玻璃布

1995-01-01

现行

KS C IEC 62326-4(2021 Confirm)

인쇄회로기판－제4부：층간 배선된 경성 다층 인쇄회로기판－부분규격
印制板第4部分:层间连接刚性多层印制板分规范

2011-07-28