MIL MIL-PRF-31032/3A Amendment 4(all prev amd incorp.)-焊接零件安装用单层和双层柔性印刷线路板带或不带镀通孔带或无加强筋-国家数字标准馆

现行 MIL MIL-PRF-31032/3A Amendment 4(all prev amd incorp.)

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Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting 焊接零件安装用单层和双层柔性印刷线路板带或不带镀通孔带或无加强筋

发布日期： 2009-06-10

本规范涵盖了柔性单面和双面（一层或两层导体）印刷线路板（以下简称印刷线路板）的一般性能要求，该线路板带有或不带有镀孔，带有或不带将使用焊接进行部件/零件安装的加强件（见6.1.1）。

This specification covers the generic performance requirements for flexible, single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes and with or without stiffeners that will use soldering for component/part mounting (see 6.1.1).

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发布单位或类别：美国-美国军事规范和标准

关联关系

研制信息

相似标准/计划/法规

JIS C 5017-1994

Flexible printed wiring boards -- Single-sided, Double-sided
柔性印制线路板单面、双面

BS DD IEC/PAS 62326-7-1-2007

Performance guide for single- and double-sided flexible printed wiring boards
单面和双面柔性印制电路板的性能指南

Printed wiring boards-Method for specifying single and double sided flexible printed wiring boards with through connections
印刷线路板带贯穿连接的单面和双面挠性印制电路板的规定方法

Printed wiring boards-Method for specifying single and double sided flexible printed wiring boards without through connections
印刷线路板无贯穿连接的单面和双面柔性印制电路板的规定方法

Performance guide Manual for single- and double-sided flexible printed wiring boards
单面和双面柔性印制电路板的性能指南手册

MIL MIL-PRF-31032/3D

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
挠性印刷线路板单层和双层带或不带电镀通孔带或不带加强筋用于焊接部件安装

MIL MIL-PRF-31032/3C Amendment 1

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板带或不带镀通孔带或无加强筋

MIL MIL-PRF-31032/3A Amendment 3

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-Through Holes, with or without Stiffeners for Soldered Part Mounting
软性印刷线路板单层和双层带或不带电镀通孔有或不带焊接部件安装用加强件

MIL MIL-PRF-31032/3B Amendment 1(amendment incorporated)

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板带或不带镀通孔带或无加强筋

MIL MIL-PRF-31032/3A Amendment 2

PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENERS FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/3)
单层和双层柔性印刷线路板带或不带镀通孔带或无加强件用于焊接部件安装（代替MIL-PRF-31032/3）

MIL MIL-PRF-31032/3A Amendment 1

PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENERS FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/3)
单层和双层柔性印刷线路板带或不带镀通孔带或无加强件用于焊接部件安装（代替MIL-PRF-31032/3）

MIL MIL-PRF-31032/2D

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷线路板刚性单层和双层热固性树脂基材带或不带电镀通孔用于焊接部件安装

MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷接线板刚性单层和双层热固性树脂基材带或不带电镀孔用于焊接部件安装

MIL MIL-PRF-31032/2C Amendment 1

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

MIL MIL-PRF-31032/2A Amendment 3

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基材刚性单层和双层印刷线路板

MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

MIL MIL-PRF-31032/2A Amendment 2

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
焊接部件安装用刚性单层和双层热固性树脂基材印刷线路板带或不带电镀通孔（代替MIL-PRF-31032/2）

MIL MIL-PRF-31032/2A Amendment 1

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
印刷接线板刚性单层和双层热固性树脂基材带或不带孔用于焊接部分安装（取代MIL-PRF-31032/2）

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