现行

JIS C 5013-1996

Single and double sided printed wiring boards
单面和双面印刷线路板

1996-01-01

现行

BS 6221-5-1982

Printed wiring boards-Specification for single and double sided rigid printed boards with plated-through holes
印刷线路板 带电镀通孔的单面和双面刚性印制板规范

1982-01-29

现行

JIS C 5017-1994

Flexible printed wiring boards -- Single-sided, Double-sided
柔性印制线路板单面、双面

1994-01-01

现行

QJ 201B-2012

航天用刚性单双面印制电路板规范
Specification for rigid single-sided and double-sided printed circuit board of aerospace

2013-01-04

现行

BS 6221-10-1991

Printed wiring boards-Specification for flex-rigid double-sided printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性双面印制板规范

1991-09-30

现行

BS 6221-4-1982

Printed wiring boards-Method for specifying single and double sided printed wiring boards with plain holes
印刷线路板 带平孔的单面和双面印刷线路板的规定方法

1982-01-29

现行

BS DD IEC/PAS 62326-7-1-2007

Performance guide for single- and double-sided flexible printed wiring boards
单面和双面柔性印制电路板的性能指南

2007-06-29

现行

MIL MIL-PRF-31032/6C

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
印刷线路板 刚性 单面和双面 热塑性树脂基材 带或不带电镀通孔 用于高频应用

2020-05-06

现行

BS 6221-8-1982

Printed wiring boards-Method for specifying single and double sided flexible printed wiring boards with through connections
印刷线路板 带贯穿连接的单面和双面挠性印制电路板的规定方法

1982-10-29

现行

BS 6221-7-1982

Printed wiring boards-Method for specifying single and double sided flexible printed wiring boards without through connections
印刷线路板 无贯穿连接的单面和双面柔性印制电路板的规定方法

1982-10-29

现行

IPC 6202

Performance guide Manual for single- and double-sided flexible printed wiring boards
单面和双面柔性印制电路板的性能指南手册

1999-10-01

现行

BS 123100-2001

System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
质量评估体系 分规范 带普通孔的刚性单面和双面印制板

2001-12-17

现行

BS 123100-003-2001

System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
质量评估体系 能力详细说明 带普通孔的刚性单面和双面印制板

2001-12-17

现行

BS 96/213356 DC

IEC 2326-3. Printed boards. Part 3. Rigid single and double sided printed boards with interlayer connections. Sectional specification. 52/676/CD
IEC 2326-3 印制板 第三部分 带有夹层连接的刚性单面和双面印制板 分规范 52/676/CD

1996-10-15

现行

BS 96/213354 DC

IEC 2326-2. Printed boards. Part 2. Rigid single and double-sided printed boards without interlayer connections. Sectional specification. 52/674/CD
IEC 2326-2 印制板 第二部分 无夹层连接的刚性单面和双面印制板 分规范 52/674/CD

1996-10-15

现行

MIL MIL-PRF-31032/2D

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷线路板 刚性 单层和双层 热固性树脂基材 带或不带电镀通孔 用于焊接部件安装

2020-03-02

现行

MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷接线板 刚性 单层和双层 热固性树脂基材 带或不带电镀孔 用于焊接部件安装

2009-07-04

现行

MIL MIL-PRF-31032/2C Amendment 1

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

2018-06-12

现行

MIL MIL-PRF-31032/2A Amendment 3

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基材刚性单层和双层印刷线路板

2008-04-23

现行

MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

2012-11-02