现行

SJ 21094-2016

印制板化学性能测试方法
Test method of chemical performance for printed circuit boards

2016-01-19

现行

SJ 21093-2016

印制板物理性能测试方法
Test method of physical performance for printed circuit boards

2016-01-19

现行

GOST 23752.1-1992

Платы печатные. Методы испытаний
印刷电路板 测试方法

现行

SJ 21096-2016

印制板环境试验方法
Test method of environmental for printed circuit boards

2016-01-19

现行

SJ 21098-2016

印制板显微剖切方法及要求
Test methods and requirements of microsection for printed circuit boards

2016-01-19

现行

SJ 21097-2016

印制板清洁度测试方法及要求
Test methods and requirements of cleanliness for printed circuit boards

2016-01-19

现行

GOST R 55744-2013

Платы печатные. Методы испытаний физических параметров
印刷电路板 物理参数测试方法

现行

SJ 21548-2020

印制电路板组装件静态应变测试方法
Test method of static strain gage for printed circuit board assemblies

2020-06-03

现行

GOST R 56252-2014

Платы печатные. Контроль влияния химических факторов и воздействия окружающей среды
印刷电路板 化学因素和环境影响测试方法

现行

GB/T 4722-2017

印制电路用刚性覆铜箔层压板试验方法
Test methods for rigid copper clad laminates for printed circuits board

2017-05-31

现行

BS PD IEC/TR 61189-3-914-2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
电气材料、印制板和其他互连结构和组件的试验方法

2017-03-31

现行

KS C IEC TR 61189-3-914

전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제3-914부: 고휘도 LED용 인쇄회로기판의 열전도성 시험방법 — 지침
电气材料、印刷电路板和其他互连结构和组件的试验方法.第3-914部分:高亮度LED用印刷电路板的导热性试验方法.指南

2023-06-30

现行

IEC TR 61189-3-914-2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
电气材料、印制板和其他互连结构和组件的试验方法.第3-914部分:高亮度LED用印制电路板导热性的试验方法.指南

2017-03-17

现行

IEC 63251-2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
热应力作用下柔性光电电路板机械性能试验方法

2023-11-01

现行

KS C IEC 63251

열응력 하에서 연성 광전자 회로기판의 기계적 특성 시험 방법
热应力下柔性光电电路板机械性能试验方法

2024-06-07

现行

BS EN IEC 61189-5-503-2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies-General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
电气材料、印制板和其他互连结构和组件的试验方法

2018-04-13

现行

IEC 61189-3-913-2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第3-913部分:高亮度LED电子电路板的导热性测试方法

2016-01-05

现行

IEC 61189-5-503-2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
电气材料、印刷电路板和其他互连结构和组件的试验方法.第5-503部分:材料和组件的通用试验方法.电路板的导电阳极丝（CAF）试验

2017-05-22

现行

DIN EN 61189-3-913-DRAFT

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs (IEC 91/1186/CD:2014)
文件草稿-电气材料、印制板和其他互连结构和组件的试验方法-第3-913部分:高亮度LED用电子电路板导热性的试验方法（IEC 91/1186/CD:2014）

2014-09-01

现行

DIN EN IEC 63251-DRAFT

Draft Document - Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress (IEC 91/1626/CD:2019); Text in German and English
文件草案——热应力下柔性光电电路板机械性能的试验方法（IEC 91/1626/CD:2019）；德语和英语文本

2020-05-01