BS EN ISO 9455-14:2017规定了一种定性方法，用于评估沥青残留物的粘性 软钎焊剂在焊接过程之后。该方法适用于所有助焊剂、锡膏和焊剂 药芯焊丝。该方法特别适用于助焊剂残留物较少的应用 留在电气和电子设备上。交叉引用:ISO 9453:2014 ED3ISO 197-1ISO 9455-1:1990（R10）ISO 9455-2:1993（R07）购买本文件时，所有当前可用的修订都包括在购买本文件中。

BS EN ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.Cross References:ISO 9453:2014 ED3ISO 197-1ISO 9455-1:1990 (R10)ISO 9455-2:1993 (R07)All current amendments available at time of purchase are included with the purchase of this document.