Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
印刷电路板设计 制造和装配 - 词汇 - 第2部分:电子技术以及印制板和电子装配技术的常用用法
IEC?60194-2:2017(E) covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.
This first edition, together with IEC?60194-1, will cancel and replace IEC?60194:2015. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC?60194:2015:
a)?exclusion of 32 general terms better served by other TCs;
b)?exclusion of 47 terms no longer used by the electronics assembly industry;
c)?inclusion of 13 new terms related with device embedded substrate technology;
d)?removal of identification codes for terms as well as annexes.