Methods for the sampling and analysis of tin and tin alloys-Method for the determination of copper in ingot tin and tin-lead solders (photometric method)
锡及锡合金的取样和分析方法
Describes the reagents required, recommended methods of sampling and test procedure for the determination of copper in ingot tin and tin-lead solders having a copper content from 0.01 to 0.4 per cent.Cross References:BS 219BS 3252BS 3332BS 3338:Part 1BS 3338:Part 12