本指南文件建立了一种声发射（AE）方法，以增强机械加载期间电子组件表面安装附件的性能和可靠性评估。机械载荷可能包括应力源，如四点弯曲试验、球形弯曲试验、后端制造和试验步骤、表面安装后连接和跌落/冲击试验。目前这种测量方法的重点是确定印制板焊盘凹坑形成机理和印制板材料性能。由于该方法仍在开发中，根据指南的演变和采用情况，该方法最终可能会扩展到检查其他故障模式。

This guideline document establishes an Acoustic Emission (AE) method to enhance evaluation of the performance and reliability of surface mount attachments of electronic assemblies during mechanical loading. Mechanical loading may include stressors such as four-point bend test, spherical bend test, back-end manufacturing and test steps post surface mount attachment and drop/shock test. The current focus for this measurement method is to identify the printed board pad cratering mechanism and printed board material performance. This approach may eventually be extended to examine other failure modes depending on the guideline's evolution and adoption, as this method remains in development.