现行

BS 6221-9-1991

Printed wiring boards-Specification for flexible multilayer boards with through connections
印刷线路板 带贯穿连接的挠性多层板规范

1991-09-30

现行

BS 123800-2001

System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
质量评估体系 分规范 具有贯穿连接的挠性多层印制板

2001-12-17

现行

BS 123800-003-2001

System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
质量评估体系 能力详细说明 具有贯穿连接的挠性多层印制板

2001-12-17

现行

BS 6221-11-1991

Printed wiring boards-Specification for flex-rigid multilayer printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性多层印制板规范

1991-08-30

现行

GB/T 18335-2001

有贯穿连接的刚挠多层印制板规范
Specification for flex-rigid multilayer printed boards with through connections

2001-03-07

现行

DIN EN 123800

Sectional specification - Flexible multilayer printed boards with through connection; German version EN 123800:1996
分规范.带贯穿连接的挠性多层印制板；德文版EN 123800:1996

1997-10-01

现行

BS EN 123800-1997

Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections
电子元件质量评定协调体系 分规范 具有贯穿连接的挠性多层印制板

1997-05-15

现行

UNE 20621-8-1985

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
印制板 带贯穿连接的单面和双面柔性印制板规范

1985-12-15

现行

BS CECC 23800-801-1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性多层印制板

1998-06-15

现行

UNE 20621-7-1985

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
印制板 无贯穿连接的单面和双面柔性印制板规范

1985-10-15

现行

MIL MIL-PRF-31032/4D

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
多层印刷线路板 刚柔 带电镀通孔 带或不带加强筋 用于焊接部件安装

2020-04-04

现行

MIL MIL-PRF-31032/4C Amendment 2

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2018-07-14

现行

MIL MIL-PRF-31032/4A Amendment 3

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2008-04-15

现行

MIL MIL-PRF-31032/4C Amendment 1

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2018-01-08

现行

MIL MIL-PRF-31032/4B Amendment 1

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2012-11-04

现行

MIL MIL-PRF-31032/4A Amendment 4

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2009-06-10

现行

MIL MIL-PRF-31032/4B Amendment 2

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2013-06-24

现行

BS 123600-2001

System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 分规范 带贯穿连接的软硬多层印制板

2001-12-17

现行

BS 123600-003-2001

System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的软硬多层印制板

2001-12-17

现行

DIN EN 123600

Sectional specification - Flex-rigid multilayer printed boards with through connections; German version EN 123600:1996
分规范.带贯穿连接的挠性-刚性多层印制板；德文版EN 123600:1996

1997-10-01