首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 IEC 62047-7:2011
到馆阅读
收藏跟踪
购买正版
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection 半导体器件 - 微机电器件第7部分:用于无线电频率控制和选择的存储器滤波器和双工器
发布日期: 2011-06-16
IEC 62047-7:2011描述了可用于评估和确定BAW谐振器、滤波器和双工器设备作为射频控制和选择设备的性能特征的术语、定义、符号、配置和测试方法。本标准规定了BAW谐振器、滤波器和双工器设备的测试方法和一般要求,这些设备通过能力或资格认证程序进行质量评估。
IEC 62047-7:2011 describes terms, definition, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of BAW resonator, filter, and duplexer devices as radio frequency control and selection devices. This standard specifies the methods of tests and general requirements for BAW resonator, filter, and duplexer devices of assessed quality using either capability or qualification approval procedures.
分类信息
关联关系
研制信息
归口单位: TC 47/SC 47F
相似标准/计划/法规
现行
BS EN 62047-4-2010
Semiconductor devices. Micro-electromechanical devices-Generic specification for MEMS
半导体器件 微机电设备
2010-11-30
现行
BS EN 62047-5-2011
Semiconductor devices. Micro-electromechanical devices-RF MEMS switches
半导体器件 微机电设备
2013-04-30
现行
GB/T 32817-2016
半导体器件 微机电器件 MEMS总规范
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS
2016-08-29
现行
IEC 62047-5-2011
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
半导体器件 - 微机电器件 - 第5部分:RF MEMS开关
2011-07-13
现行
IEC 62047-4-2008
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
半导体器件 - 微机电器件第4部分:Mems的通用规范
2008-08-21
现行
GB/T 42709.5-2023
半导体器件 微电子机械器件 第5部分:射频MEMS开关
Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches
2023-05-23
现行
BS IEC 62047-33-2019
Semiconductor devices. Micro-electromechanical devices-MEMS piezoresistive pressure-sensitive device
半导体器件 微机电设备
2019-04-18
现行
BS EN 62047-10-2011
Semiconductor devices. Micro-electromechanical devices-Micro-pillar compression test for MEMS materials
半导体器件 微机电设备
2011-09-30
现行
IEC 62047-33-2019
Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
半导体器件微机电器件第33部分:MEMS压阻压敏器件
2019-04-05
现行
IEC 62047-41-2021
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
半导体器件.微机电器件.第41部分:RF MEMS环行器和隔离器
2021-06-15
现行
IEC 62047-10-2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
半导体器件 - 微机电器件 - 第10部分:MEMS材料的微柱压缩测试
2011-07-26
现行
KS C IEC 62047-7(2020 Confirm)
반도체소자 ― 초소형 전기기계소자 ― 제7부: RF 조절 및 선택용 MEMS 체적 탄성파 필터와 듀플렉서
半导体器件微机电器件第7部分:射频控制和选择用MEMS BAW滤波器和双工器
2015-12-30
现行
GB/T 42709.7-2023
半导体器件 微电子机械器件 第7部分:用于射频控制和选择的MEMS体声波滤波器和双工器
Semiconductor devices—Micro-electromechanical devices—Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
2023-05-23
现行
BS 08/30172394 DC
BS EN 62047-7. Semiconductor devices. Micro-electromechanical devices. P art 7. MEMS FBAR Filter & Duplexer
英国标准EN 62047-7 半导体器件 微型机电设备 P第7条 MEMS FBAR滤波器和双工器
2008-04-29
现行
BS EN 62047-9-2011
Semiconductor devices. Micro-electromechanical devices-Wafer to wafer bonding strength measurement for MEMS
半导体器件 微机电设备
2013-01-31
现行
BS IEC 62047-32-2019
Semiconductor devices. Micro-electromechanical devices-Test method for the nonlinear vibration of MEMS resonators
半导体器件 微机电设备
2019-01-29
现行
IEC 62047-32-2019
Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
半导体器件微机电器件第32部分:MEMS谐振器非线性振动的试验方法
2019-01-24
现行
IEC 62047-9-2011
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
半导体器件 - 微机电器件 - 第9部分:晶圆晶片接合强度测量
2011-07-13
现行
BS IEC 62047-34-2019
Semiconductor devices. Micro-electromechanical devices-Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件 微机电设备
2019-04-16
现行
IEC 62047-34-2019
Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件微机电器件第34部分:硅片上MEMS压阻压敏器件的试验方法
2019-04-05