IPC 2222B旨在提供有机硬质印制板设计的详细要求信息。设计要求的所有方面和细节均适用于使用有机刚性（增强）材料或有机材料与无机材料（金属、玻璃、陶瓷等）组合的设计的独特要求，以提供用于安装和互连电子、机电、，以及机械零件。

IPC 2222B is intended to provide information on the detailed requirements for organic rigid printed board design. All aspects and details of the design requirements are addressed to the extent that they can be applied to the unique requirements of those designs that use organic rigid (reinforced) materials or organic materials in combination with inorganic materials (metal, glass, ceramic, etc.) to provide the structure for mounting and interconnecting electronic, electromechanical, and mechanical components.