由于对提高产品能力的需求，全球半导体行业正在经历一场革命。其中包括0.1微米或更小的特征尺寸；1千兆芯片密度；晶圆尺寸为300毫米以上；700个处理步骤。因此，必须在晶圆处理、晶圆加工、过程控制、材料纯度、晶圆厂组织、晶圆厂自动化、设备利用率、CIM、成本控制等方面进行范式转换。为了生存，制造商必须在无缺陷制造、工艺步骤计数、设备可靠性和稳定性、周期时间和产量等方面进行根本性改进。目标很可能是一个完全自动化、计算机集成并在微环境中运行的工厂。

THE GLOBAL SEMICONDUCTOR INDUSTRY IS UNDERGOING A REVOLUTION DUE TO DEMANDS FOR INCREASING PRODUCT CAPABILITIES. AMONG THESE ARE FEATURE SIZES AT 0.1 MICRON OR LESS; 1 GIGABIT CHIP DENSITY; WAFER SIZES OF 300MM-PLUS; AND 700 PROCESSING STEPS. CONSEQUENTLY, PARADIGM SHIFTS MUST OCCUR IN WAFER HANDLING, WAFER PROCESSING, PROCESS CONTROL, MATERIAL PURITIES, FAB ORGANIZATION, FAB AUTOMATION, EQUIPMENT UTILIZATION, CIM, COST CONTAINMENT AND MORE. TO SURVIVE, MANUFACTURERS MUST RADICALLY IMPROVE IN SUCH AREAS AS DEFECT-FREE MANUFACTURING, PROCESS STEP COUNT, EQUIPMENT RELIABILITY AND STABILITY, CYCLE TIME AND YIELD. THE GOAL WILL LIKELY BE A FAB WHICH IS FULLY AUTOMATED, COMPUTER INTEGRATED AND FUNCTIONING IN MICROENVIRONMENTS.