现行

GB/T 4725-2022

印制电路用覆铜箔环氧玻纤布层压板
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits

2022-03-09

现行

BS EN 60249-2-4-1994

Specifications-Specification for epoxide woven glass fabric copper-clad laminated sheet, general purpose grade-Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade
规格

2001-04-15

现行

GB/T 12630-1990

一般用途的薄覆铜箔环氧玻璃布层压板 （制造多层印制板用）
Thin epoxide woven glass fabric copper-clad laminated sheet， general purpose grade， for use in the fabrication of multilayer printed boards

1990-12-28

现行

BS EN 60249-2-19-1993

Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格 第19号规范 用于制造多层印制板的规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1992-09-15

现行

BS EN 60249-2-10-1994

Specifications-Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-06-01

现行

JIS C 6494-1999

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基材多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1999-01-01

现行

BS EN 60249-2-11-1994

Specifications-Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
规格

2001-06-15

现行

BS EN 60249-2-17-1993

Specifications-Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格

2001-06-15

现行

BS EN 60249-2-18-1993

Specifications-Specification No. 18. Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-06-15

现行

JIS C 6493-1999

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

现行

SJ 20224-1992

印制线路板用阻燃型覆铜箔环氧玻璃布层压板详细规范
Detail specification for epoxide woven glass fabric copper-clad laminated sheets of flammability resistance for printed wiring boards

1992-11-19

现行

UNE-EN 60249-2-12-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范12:多层印制板制造用规定可燃性的薄环氧玻璃纤维织物覆铜层压板

1996-07-24

现行

GB/T 16315-2017

印制电路用覆铜箔聚酰亚胺玻纤布层压板
Polymide woven glass fabric copper clad laminated sheets for printed circuits

2017-07-31

现行

JIS C 6492-1998

Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃布覆铜层压板（垂直燃烧试验）

1998-01-01

现行

JIS C 6489-1999

Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的环氧无纺布/玻璃纤维增强覆铜层压板（垂直燃烧试验）

1999-01-01

现行

BS EN 60249-2-16-1993

Specifications-Specification No. 16. Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-06-15

现行

UNE-EN 60249-2-5-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº5: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
印刷电路的基材 第2部分:规范 规范5:规定可燃性的环氧玻璃纤维织物覆铜层压板（垂直燃烧试验）

1996-11-07

现行

UNE-EN 60249-2-19/A2-1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板

1997-10-17

现行

UNE-EN 60249-2-19/A1-1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板

1997-10-17

现行

UNE-EN 60249-2-19-1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板

1997-08-11