本文件对解决日常问题非常有用，对一线工艺工程师和主管来说非常宝贵。它包含印刷线路产品设计、制造、组装和测试中的问题和纠正措施的案例。本文件的每一部分都经过了更新，以反映当今制造业面临的挑战。指南中包含的章节涉及的主题包括文件、光加工、原材料、机械操作、孔准备、电镀通孔、清洁程序、成像、电镀、蚀刻、内层制造层压、焊接、金属保护涂层、非金属保护涂层、组件制备和组装、检查和测试、，以及返工和修复。包括彩色和黑白照片及插图。 这个新版本的特点是一个扩展的组装章节，现在包括焊接，清洁和焊接后的过程。 此外，还增加了传统故障排除流程的新示例。修订版还包括一个易于使用的索引，以帮助您找到最相关的信息。

Useful for day-to-day problem solving, this document is invaluable for front line process engineers and supervisors. It contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section of the document has been updated to reflect today's manufacturing challenges. Sections included in the Guide address topics such as documentation, phototooling, raw materials, mechanical operations, hole preparation, plated-through hole, cleaning procedures, imaging, electroplating, etching, innerlayer fabrication lamination, soldering, metallic protective coatings, non-metallic protective coatings, component preparation and assembly, inspection & test, and rework and repair. Includes color and black and white photos and illustrations. This new revision features an expanded assembly chapter that now includes soldering, cleaning and post soldering process. New examples of aditional processes for troubleshooting have been added as well. The revision also includes an easy-to-use index to assist you in finding the most relevant information.