现行

MIL MIL-P-13949/21 Notice 1-Cancellation

PLASTIC SHEET, LAMINATED, MATERIALS (FOR PRINTED WIRING BOARDS), BASE MATERIAL, AI, ARAMID, WOVEN, MAJORITY POLYIMIDE, RESIN, PREIMPREGNATED (B-STAGE) (NO S/S DOCUMENT)
塑料片 层压 材料（用于印制线路板） 基材 AI 芳纶 机织 大部分聚酰亚胺 树脂 预浸渍（B级）（无S/S文件）

1994-01-25

现行

MIL MIL-S-13949/27A

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL SC (WOVEN S-2 GLASS FIBER 1/ REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/27) (NO S/S DOCUMENT)
基材SC层压印刷线路板（编织S-2玻璃纤维1/增强 多数氰酸酯树脂 阻燃 金属包覆或未包覆）（替代MIL-S-13949/27）（无S/S文件）

1993-05-18

现行

MIL MIL-S-13949/27A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL SC (WOVEN S-2 GLASS FIBER 1/ REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/27) (NO S/S DOCUMENT)
薄板 印刷线路板 层压 基材SC（编织S-2玻璃纤维1/增强 多数氰酸酯树脂 阻燃 金属包覆或非包覆）（取代MIL-S-13949/27）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/28A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL SC (WOVEN S-2 GLASS FIBER 1/ REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/28) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材SC（编织S-2玻璃纤维1/增强、多数氰酸酯树脂、阻燃）（替代MIL-S-13949/28）（无S/S文件）

1993-05-18

现行

MIL MIL-S-13949/28A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL SC (WOVEN S-2 GLASS FIBER 1/ REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/28) (NO S/S DOCUMENT)
片材 印刷线路板 预浸料 基材SC（编织S-2玻璃纤维1/增强 多数氰酸酯树脂 阻燃）（取代MIL-S-13949/28）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/15C

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/15B) (NO S/S DOCUMENT)
基材AF层压印刷线路板（编织芳纶增强、环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/15B）（无S/S文件）

1993-03-28

现行

MIL MIL-S-13949/19A

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
基材QI层压印刷线路板（编织石英增强、聚酰亚胺树脂、耐热、金属包覆或非包覆）（替代MIL-S-13949/19）（无S/S文件）

1993-12-06

现行

MIL MIL-S-13949/19A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
片材 印刷线路板 层压 基材QI（编织石英增强 聚酰亚胺树脂 耐热 金属包覆或未包覆）（取代MIL-S-13949/19）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/19A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
片材 印刷线路板 层压 基材QI（编织石英增强 聚酰亚胺树脂 耐热 金属包覆或未包覆）（取代MIL-S-13949/19）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/15C Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/15B) (NO S/S DOCUMENT)
层压印刷线路板片材 基材AF（芳纶增强编织物 环氧树脂 阻燃 金属包覆或未包覆）（取代MIL-S-13949/15B）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/15C Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/15B) (NO S/S DOCUMENT)
（代替MIL-S-13949/15B）（不含S/S文件）的印刷线路板 层压基材（WOVEN ARAMID加固 环氧树脂 阻燃剂 金属粘合剂或包合物）

1997-08-01

现行

MIL MIL-P-13949/8D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
覆铜箔阻燃聚四氟乙烯树脂编织玻璃基GT基材金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/8C）（无S/S文件）

1988-03-28

现行

MIL MIL-P-13949/8D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GT 玻璃基 编织聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/8C）（无S/S文件）

1994-07-11

现行

MIL MIL-P-13949/8D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GT 玻璃基 WOVEN 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/8C）（NO S/S文件）

1988-03-28

现行

MIL MIL-S-13949/10C Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/10B) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GI（编织电子玻璃增强材料、聚酰亚胺树脂、耐热、金属包覆或非包覆）（取代MIL-S-13949/10B）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/10C

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/10B) (NO S/S DOCUMENT)
基材GI层压印刷线路板（编织E玻璃增强、聚酰亚胺树脂、耐热、金属包覆或非包覆）（替代MIL-S-13949/10B）（无S/S文件）

1993-08-06

现行

MIL MIL-P-13949/6D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
覆铜阻燃聚四氟乙烯树脂无纺布基材GP玻璃基金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/6C）（无S/S文件）

1987-02-11

现行

MIL MIL-P-13949/6D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GP 玻璃基 非织造布 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/6C）（无S/S文件）

1987-02-11

现行

MIL MIL-P-13949/6D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/6C）（无S/S文件）

1994-07-11

现行

MIL MIL-P-13949/6D Notice 2-Inactivation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/6C）（无S/S文件）

1997-08-01