现行

SJ 20748-1999

刚性印制板及刚性印制板组装件设计标准
Design standard for rigid printed boards And rigid printed board assemblies

1999-11-10

现行

GOST R 55693-2013

Платы печатные жесткие. Технические требования
刚性印刷板 技术要求

现行

IPC M-104

Standards for Printed Board Assembly Manual
印制板组装手册标准

现行

IPC M-107

Standards for Printed Board Materials Manual
印制板材料标准手册

现行

BS EN 62326-4-1997

Printed boards-Rigid multilayer printed boards with interlayer connections. Sectional specification
印制板 带有夹层连接的刚性多层印制板 分规范

1997-06-15

现行

BS 6221-11-1991

Printed wiring boards-Specification for flex-rigid multilayer printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性多层印制板规范

1991-08-30

现行

IPC 6012E

Qualification and Performance Specification for Rigid Printed Boards
刚性印制板的鉴定和性能规范

2020-02-01

现行

NASA NHB 5300.4(3K)

DESIGN REQUIREMENTS FOR RIGID PRINTED WIRING BOARD
刚性印刷线路板的设计要求

1986-01-01

现行

GB/T 4588.4-2017

刚性多层印制板分规范
Sectional specification for rigid multilayer printed boards

2017-07-31

现行

MIL MIL-PRF-55110H Amendment 2

Printed Wiring Board, Rigid, General Specification for
刚性印刷线路板通用规范

2017-05-19

现行

MIL MIL-PRF-55110H Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, General Specification for
刚性印刷线路板通用规范

2016-05-20

现行

MIL MIL-PRF-55110H Amendment 3

Printed Wiring Board, Rigid, General Specification for
刚性印刷线路板通用规范

2018-03-26

现行

MIL MIL-PRF-55110G Notice 3-Revision

Printed Wiring Board, Rigid, General Specification for
刚性印刷线路板通用规范

2008-02-29

现行

MIL MIL-PRF-55110J

Printed Wiring Board, Rigid, General Specification for
刚性印制线路板通用规范

2020-05-16

现行

BS 6221-10-1991

Printed wiring boards-Specification for flex-rigid double-sided printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性双面印制板规范

1991-09-30

现行

IEC 62326-4-1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
印刷电路板 - 第4部分:具有层间连接的刚性多层印刷电路板 - 分段规格

1996-12-19

现行

KS C IEC 62326-4(2016 Confirm)

인쇄회로기판－제4부：층간 배선된 경성 다층 인쇄회로기판－부분규격
印制板第4部分:层间连接刚性多层印制板分规范

2011-07-28

现行

KS C IEC 62326-4(2021 Confirm)

인쇄회로기판－제4부：층간 배선된 경성 다층 인쇄회로기판－부분규격
印制板第4部分:层间连接刚性多层印制板分规范

2011-07-28

现行

GOST IEC 62326-4-2013

Платы печатные. Часть 4. Жесткие многослойные печатные платы с межслойными соединениями. Технические условия
印刷板具有层间连接的刚性多层印刷电路板 剖面规格

2013-11-14

现行

UNE-EN 62326-4-1999

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS. SECTIONAL SPECIFICATION.
印制板 第4部分:带夹层连接的刚性多层印制板 分规范

1999-04-19